chore(iolink): bump device+master pins to spec-conformant wire - #475
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Bump third_party/iolinki submodule to cac724a and re-vendor the iolinki-master stack at 3d54109, both carrying the V1.1.5-conformant wire (startup probe MC 0xA2; OPERATE via MasterCommand 0x99 page-channel write; ISDU I-Service nibbles 0xB read / 0x3 write). Firmware wrappers drive the C stacks via their public APIs, so the station model needs no octet changes. Rebuilt all five STM32L476 ELFs and reran the multichip, iolink-dido, and service-coverage harnesses: startup->OPERATE, cyclic PD, ISDU, EVENT and data-storage all green.
w1ne
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Jul 18, 2026
chore(iolink): bump device+master pins to spec-conformant wire
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Bumps the vendored IO-Link stacks to the V1.1.5 spec-conformant wire (startup probe
0xA2, OPERATE transition via MasterCommand0x99, ISDU I-Service nibble0xB/0x3per Table A.12), replacing the previous co-designed octets. Part of a coordinated rollout withiolinki(device, w1ne/iolinki#21) andiolinki-master(master, w1ne/iolinki-master#16).Pins
third_party/iolinkisubmodule →cac724ad(conformant device).third_party/iolinki-masterre-vendored →3d541094(conformant master).Verification (local, real STM32L476 firmware)
All 5 ELFs link; all three iolink-station harnesses pass:
world_multichip: 4-port station all reach OPERATE, real PD exchangePDs=[a5,3c,c3,5a].e2e_iolink_dido: pass.world_station_services(-svccoverage): conformantSTATE 01→02→03→04 OPERATE, then ISDU (vendor="LABWIRED"), PDOUT, EVENT, and data-storage all green.No firmware/harness changes were needed — the wrappers drive the C stacks through public APIs, so the pin bump alone carries the conformant wire.